Bondexpo 2021 - Make sure to save your tickets now!
Don't miss the opportunity to visit us at BONDEXPO 2021 - the international trade fair for adhesive bonding technology. The trade show will take place from 05 to 08 October 2021 at Messe Stuttgart – you will find us in Hall 5, Stand 5417.
We will be happy to provide you with complimentary tickets. Due to the pandemic, all tickets will be personalized and therefore require online registration – simply register here!
We are very much looking forward to meeting you in person, to talk about the benefits, H&H could bring to your company. Come and see the latest technologies of precision roller applicators, hot melt application systems and melting systems.