H&H Klebetechnologie at the Bondexpo Trade exhibition 2021
From the 05th until the 08th of October 2021, the 14th BONDEXPO - the international trade fair for adhesive bonding technology - will take place at Messe Stuttgart.
The hygiene concept presented by the trade show organizer was thorough and convincing, so H&H Klebetechnologie decided to join the BONDEXPO and to be represented with a booth. We strongly feel nothing can beat a personal conversation – especially in these difficult times – which is why we are looking forward to participating at the trade show if circumstances will allow.
The preparations for the H&H representation are already in progress and we are excited to welcome you in person to our booth with the newest roller applicators and hot melt premelters.
Due to the pandemic, all tickets are going to be personalized and therefore will require an online registration. We hope that this will be no issue for you, and we would like to welcome you anytime during BONDEXPO 2021, stand 5417 in hall 5, to meet our team.
To receive your free ticket(s), please contact our sales team at email@example.com or simply register here.
Of course, we also have some technical information about BONDEXPO* for you:
Adhesive bonding technology in focus
Bondexpo is the world's number one industry and user meeting place. With clear and consistent focus on the process chain of joining / bonding by bonding, potting, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.
This especially applies to new requirements in terms of resource conservation, material and energy efficiency through material mix/hybrid constructions for lightweight construction or miniaturization for microsystems technology applications.
Bondexpo will happen in parallel to Motek, the international trade show for assembly, handling, and automation technology. The trade show combination impressively shows the necessity of looking beyond one's own nose in order to being able to present the production and assembly technology process chains, including elementary connection and joining technology by means of bonding, without any gaps.
*source: P.E.Schall GmbH & Co. KG